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1 Introduction to Surface Mount Technology
2 Fundamentals of Solders and Soldering
3 Solder Paste Technology
4 Surface Mount Assembly Processes
5 SMT Problems Prior to Reflow
6 SMT Problems During Reflow
7 SMT Problems At the Post- reflow Stage
8 Solder Bumping for Area Array Packages
9 BGA and CSP Assembly and Rework
10 Flip Chip Reflow Attachment
11 Optimizing a Reflow Profile Via Defect Mechanisms Analysis
12 Lead-free Soldering
Click Here To Download
Reflow Soldering Processes and
Troubleshooting: SMT, BGA, CSP
and Flip Chip Technologies
Ning-Cheng Lee
Troubleshooting: SMT, BGA, CSP
and Flip Chip Technologies
Ning-Cheng Lee
Table of Contents
2 Fundamentals of Solders and Soldering
3 Solder Paste Technology
4 Surface Mount Assembly Processes
5 SMT Problems Prior to Reflow
6 SMT Problems During Reflow
7 SMT Problems At the Post- reflow Stage
8 Solder Bumping for Area Array Packages
9 BGA and CSP Assembly and Rework
10 Flip Chip Reflow Attachment
11 Optimizing a Reflow Profile Via Defect Mechanisms Analysis
12 Lead-free Soldering
Click Here To Download
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