Popular Posts

Most Viewed

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Engineering books download,engineering books free download,engineering free books,download free engineering books,engineering books free free Download,free engineering book,engineering ebooks ,free engineering book download,free download of engineering books,engineering book download,engineering chemistry,download books for free,pdf books free,online books download,e books for free,books for free download
 
Reflow Soldering Processes and
Troubleshooting: SMT, BGA, CSP
and Flip Chip Technologies
Ning-Cheng Lee


Table of Contents 

 1 Introduction to Surface Mount Technology

2 Fundamentals of Solders and Soldering

3 Solder Paste Technology

4 Surface Mount Assembly Processes

5 SMT Problems Prior to Reflow

6 SMT Problems During Reflow

7 SMT Problems At the Post- reflow Stage

8 Solder Bumping for Area Array Packages

9 BGA and CSP Assembly and Rework

10 Flip Chip Reflow Attachment

11 Optimizing a Reflow Profile Via Defect Mechanisms Analysis

12 Lead-free Soldering




Click Here To Download

1 comments:

  1. sameer said...:

    When your website or blog goes live for the first time, it is exciting. That is until you realize no one but you and your. wave soldering machine

Post a Comment