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Reflow Soldering Processes

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Reflow Soldering Processes and
Troubleshooting: SMT, BGA, CSP
and Flip Chip Technologies
Ning-Cheng Lee


Table of Contents 

1 Introduction to Surface Mount Technology

2 Fundamentals of Solders and Soldering

3 Solder Paste Technology

4 Surface Mount Assembly Processes

5 SMT Problems Prior To Reflow

6 SMT Problems During Reflow

7 SMT Problems At the Post- reflow Stage

8 Solder Bumping for Area Array Packages

9 BGA and CSP Assembly and Rework

10 Flip Chip Reflow Attachment

11 Optimizing a Reflow Profile Via Defect Mechanisms Analysis

12 Lead-free Soldering



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